Fachgebiete am Fachbereich Ingenieurwissenschaften im Überblick

The laboratory course usually consists of a theoretical part and a practical part. In the theoretical part, the physical and chemical basics of lithography and etching processes are explained. There is also an introduction to microstructure measurement technology. In the practical part, students carry out the structuring of silicon wafers under supervision: The wafer is coated, exposed, developed and etched, and the resulting structures are qualified using the available measurement methods. In addition, the students carry out individual small projects in groups of two as independently as possible or prepare a presentation on a process that cannot be covered in the practical part of the laboratory.