Fachgebiete am Fachbereich Ingenieurwissenschaften im Überblick

The laboratory consists of an approximately 50 square meter clean room area (class 1 to 100) with an associated airlock, an equipment room and an office area. Microstructuring techniques are established here:

• Photolithographic processes (standard resist technologies, thick resist technology with SU-8, image reversal)
• Double-sided UV exposure (Maskaligner Karl Süss, contact or proximity exposure, 4", 5")
• Laser direct writing (Heidelberg Instruments μPG 101, 325nm, various foci)
• Wet chemical isotropic and anisotropic etching technology (primarily for silicon)
• Dry etching technology (Reactive Ion Etching-ICP, Oxford Plasma Pro100 Cobra)
• Coating techniques (PECVD, spin coating; other processes such as DC and HF magnetron sputtering, thermal evaporation and ALD can be found in the vacuum technology laboratory)
• Separation of silicon and glass wafers (Karl Süss wafer scoring machine and DISCO wafer saw)
• Set-up for inter-beam interference lithography (outsourced to the laboratory for optical material properties, room U23)
• Theta - 2 theta measuring station (e.g. for recording reflection spectra and analyzing diffraction on optical microstructures, location U23)

The following are available for the characterization of microstructures for measurement and detection purposes

• various optical microscopes (with CCD camera and image processing)
• AFM-STM (PARC Scientific CP2)
• Coating thickness and surface profilometer (DEKTAK 3)
• Confocal chromatic surface probe (PRECITEC CHROCODILE; U23)
• Interference optical coating thickness gauge
• Spectroscopic ellipsometer and white light interferometer (in the laboratory for technical optics)
• Scanning electron microscope (in the femtosecond laser laboratory)

The laboratory is networked with other IMtech laboratories, especially those for technical optics, vacuum technology and spectroscopy. Their potential in terms of equipment, measuring methods and know-how is used for projects and courses.