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IMtech – Institute for Microtechnologies at RheinMain University of Applied Sciences

Equipment at IMtech

Microsystems Technology

Cleanroom and lithography

  • Cleanroom ISO class 3
  • Raith electron beam lithography with EBIE and nanomanipulation (since 04/2026)
  • Heidelberg Instruments µPG 101 laser direct writing system
  • Süss MJB21 double-sided mask aligner (4″)
  • Photolithographic processes (image reversal resist technology, thick resist technology with SU-8, a wide range of standard resist technologies)
  • Setup for multi-beam interference lithography
  • Wet chemistry area with ultrapure water, ultrasonic bath and spin coater

Deposition and vacuum technology

  • Balzers magnetron sputtering system for layer systems (3 targets, 3″)
  • Pink magnetron sputtering system with IBE for layer systems (3 targets, 6″) (currently being overhauled)
  • RF sputtering system for dielectric layers (SiO2)
  • Satis electron beam evaporator (4 crucibles)
  • HVD thermal evaporator (1 crucible)
  • BENEQ R2 atomic layer deposition for Al2O3 and Si3N4
  • Plasma enhanced chemical vapour deposition (PECVD)
  • Various vacuum systems for general applications (down to 10−9 mbar)
  • Outgassing rate test stand (in-house development)

Etching and ion beam technology

  • Oxford Instruments PlasmaPro 100 Cobra ICP etcher
  • Ion beam etcher (IBE) with 4″ Kaufman source
  • Hollow cathode ion source up to 5 keV (in-house development)
  • SPECS IQE 11 hot cathode ion source

Packaging and interconnection

  • Acretech SS11 dicing saw
  • Automatic wafer scriber (Karl Süss)
  • TPT HB05 wire bonder

Analysis and characterisation

  • Jeol JSM-6380LV scanning electron microscope with low-vacuum option and Ametek Octane Elect EDX
  • Omicron AFM-1 UHV AFM/STM system (currently being overhauled)
  • Digital Instruments CP II atomic force microscope
  • Bruker Dektak Pro profilometer
  • Precitec CHRocodile profilometer (chromatic confocal)
  • Optical microscopy, including Keyence VHX
  • Interferometric layer thickness gauge
  • Spectroscopic ellipsometer and white-light interferometer
  • Theta–2-theta measuring station, e.g. for analysing diffraction at optical microstructures
  • Quadrupole mass spectrometer

Photonics

Laser systems

  • Ti:sapphire solid-state laser oscillator Mai Tai (Spectra-Physics), 84 MHz, 25 fs, >400 mW @ 800 nm – seed laser of the laser amplifier
  • Solid-state laser Ascend 60, 527 nm, 1 kHz, 30 W, 140 ns, 35 mJ – pump laser of the amplifier and for ns laser annealing experiments
  • Ti:sapphire laser amplifier system Spitfire Ace (Spectra-Physics), 7 W @ 800 nm, 1 kHz and switchable to 10 kHz, 100 fs, 7 mJ pulse energy @ 1 kHz – for producing femtosecond-laser sulfur-hyperdoped black silicon
  • Optical upgrade kit for converting the amplifier to 35 fs pulse duration

Beam delivery and materials processing

  • Vibration-isolated laser table M-RS2000 including laser safety equipment, flow boxes and air conditioning
  • Computer-controlled beam attenuation
  • 3D microscanner from LightFab: combined galvanometer/mechanical laser scanning system
  • High-precision mechanical 3-axis stage from Newport, 150 mm travel

Characterisation

  • Laser beam and pulse characterisation (autocorrelator including detector modules, IR viewer, beam power meter, spectrometer for bandwidth measurement, beam profiler)
  • Spectroscopic ellipsometer and white-light spectrometer from PerkinElmer (200–3300 nm)
  • UV-VIS-NIR spectrometer with integrating sphere from PerkinElmer